Intel Core i3-530 i3 530 2.9 GHz, Dual-Core CPU Procesorius 4M 73W LGA 1156

Intel Core i3-530 i3 530 2.9 GHz Dual-Core CPU Processor 4M 73W LGA 1156

Intel Core i3-530 specifications

The specs can be used for short-term

listings on auction and classifieds sites

General information

Type

Market segment

Desktop

Family

Model number

i3-530

CPU part numbers

CM80616003180AG is an OEM/tray microprocessor

BX80616I3530 is a boxed processor with fan and heatsink (English version)

BXC80616I3530 is a boxed processor with fan and heatsink (Chinese version)

Frequency

2933 MHz

Bus speed

2.5 GT/s DMI

Package

1156-land Flip-Chip Land Grid Array (FC-LGA10)

Socket

Socket 1156 / H1 / LGA1156

Size

1.48" x 1.48" / 3.75cm x 3.75cm

Weight

0.9oz / 24.6g (CPU)

11.5oz / 325.3g (box)

Fan/heatsink

E41997-002 (CN2F9381M2)

Introduction date

End-of-Life date

Last order date is April 27, 2012

Last shipment date is October 5, 2012

Price at introduction

$113

S-spec numbers

Part number

ES/QS processors

Production processors

BX80616I3530

+

+

BXC80616I3530

+

+

CM80616003180AG

+

+

+

+

Architecture / Microarchitecture

Microarchitecture

Westmere

Processor core

Core steppings

C2 (Q3GR, SLBLR)

K0 (Q4ME, SLBX7)

CPUID

20652 (SLBLR)

Manufacturing process

0.032 micron

382 million transistors (CPU die)

177 million transistors (IMC / graphics die)

Die

81mm2(CPU die)

114mm2(IMC / graphics die)

Data width

64 bit

The number of CPU cores

2

The number of threads

4

Floating Point Unit

Integrated

Level 1 cache size

2 x 32 KB 4-way set associative instruction caches

2 x 32 KB 8-way set associative data caches

Level 2 cache size

2 x 256 KB 8-way set associative caches

Level 3 cache size

4 MB 16-way set associative shared cache

Physical memory

16 GB

Multiprocessing

Uniprocessor

Features

MMX instructions

SSE / Streaming SIMD Extensions

SSE2 / Streaming SIMD Extensions 2

SSE3 / Streaming SIMD Extensions 3

SSSE3 / Supplemental Streaming SIMD Extensions 3

SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4

EM64T / Extended Memory 64 technology / Intel 64

VT-x / Virtualization technology

NX / XD / Execute disable bit

HT / Hyper-Threading technology

Low power features

Thread C1, C3 and C6 states

Core C1/C1E, C3 and C6 states

Package C1/C1E, C3 and C6 states

Enhanced SpeedStep technology

Integrated peripherals / components

Integrated graphics

GPU Type: HD (Westmere)

Base frequency (MHz): 733

The number of supported displays: 2

Memory controller

The number of controllers: 1

Memory channels: 2

Supported memory: DDR3-1066, DDR3-1333

Maximum memory bandwidth (GB/s): 21.3

Other peripherals

Direct Media Interface

PCI Express 2.0 interface

Electrical / Thermal parameters

V core

0.65V - 1.4V

Minimum/Maximum operating temperature

5°C - 72.6°C

Maximum power dissipation

6 Watt (TDP in C6 state) / 170.83 Watt (peak)

128.71 Watt (sustained)

Thermal Design Power

73 Watt